Product Description:

Incure Uni-Weld™ 1465 is a superior industrial-grade bonder that cures tack-free, offering exceptional performance on metals, glass, ceramics, and other high-strength multi-substrates. Its very low shrinkage property makes it ideal for applications in positioning optics and devices where minimal drift is required. The slight translucent finish ensures a clean and precise bond.

Key Features:

• Substrates: High Strength Multi-Substrates
• Color: Slight Translucent
• Viscosity: 6,000 cP
• Tensile (psi): 5,400
• Hardness: D60-D70
• Elongation: 105%
• Highlights: Cures tack-free, superior bonder for multi-substrates, ideal for positioning optics and devices, very low shrinkage