Incure Uni-Seal™ 3718F Flexible Encapsulant for Electronics with Secondary Heat Cure – 10ml / 30ml / 1kg

Product Description:

Incure Uni-Seal™ 3718F is a flexible encapsulant designed for electronic devices. It cures in seconds with a secondary heat cure option for hidden areas, ensuring a complete and reliable bond. This highly viscous, slightly translucent material bonds to many different substrates, providing a protective and flexible layer for various electronic applications.

Key Features:

• Substrates: Multi-Substrates
• Color: Slightly Translucent
• Viscosity: 14,000 cP
• Tensile (psi): 2,400-5,200
• Hardness: D40-D50
• Elongation: 254%
• Highlights: Flexible encapsulant, cures in seconds, secondary heat cure option for hidden areas, bonds to many different substrates