Incure GapFill™ D98 Thermal Cycling Resistant Adhesive for High-Stress Bonds – 20g / 500g
Product Description:
GapFill™ D98 is a clear, medium-viscosity adhesive designed to withstand thermal cycling. Its unique formulation provides a strong, durable bond that maintains its integrity through repeated temperature fluctuations, making it ideal for applications in electronics, automotive, and other industries where thermal stress is a concern.
Key Features:
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