Incure Epo-Weld™ 6429 High-Tg, High-Viscosity Epoxy for Electronic Device Bonding – 50ml
Product Description:
Incure Epo-Weld™ 6429 is a high-viscosity, high-Tg two-part epoxy adhesive for electronic device bonding. An elevated temperature post-cure is necessary to obtain maximum high-temperature stability and optimum properties. This adhesive provides a strong and reliable bond for critical electronic components.
Key Features:
- Application: Electronic device bonding
- Color: Part A – Light Grey, Part B – Brown
- Viscosity (cP): Part A – 186,000–435,000, Part B – 58,800–137,500
- Hardness: D90
- Pot Life: 30 mins